Teramount recently demonstrated a 100x improvement in tolerance for assembling fiber-to-silicon chips, compared with existing technologies.
The company’s project is targeting one of the most significant challenges of next-gen data center co-packaged switches: the need to connect in a completely reliable and cost-effective way hundreds of fibers to a single switch chip at high yield.
>> Click here to read the full article originally published on EETimes: Silicon photonics startup focuses on connectivity
